Title :
Life cycle assessment of tin-lead solder and silver-epoxy conductive adhesive
Author :
Segerberg, Tomas ; Hedemalm, Per
Author_Institution :
IVF, Molndal, Sweden
Abstract :
Lead is becoming an increasingly unwanted material due to its toxic qualities. The objective of this study is to find out if an alternative lead-free solder technology can be recommended given the LCA knowledge we have today. Conductive adhesive is chosen as alternative to tin-lead solder. The result depends entirely on how the environmental loads from production of silver, tin and lead are divided between these metals since in many cases they are produced simultaneously. Further, the environmental effects of silver, tin and lead waste are very uncertain. Therefore, it cannot be determined whether tin-lead solder or conductive adhesive is the best environmental alternative
Keywords :
adhesion; environmental factors; soldering; Ag; SnPb; environmental effects; environmental loads; lead-free solder technology; life cycle assessment; silver-epoxy conductive adhesive; Conducting materials; Conductive adhesives; Electronics industry; Environmentally friendly manufacturing techniques; In vitro fertilization; Lead; Production; Recycling; Silver; Tin;
Conference_Titel :
Electronics and the Environment, 1996. ISEE-1996., Proceedings of the 1996 IEEE International Symposium on
Conference_Location :
Dallas, TX
Print_ISBN :
0-7803-2950-3
DOI :
10.1109/ISEE.1996.500399
