Life cycle assessment of tin-lead solder and silver-epoxy conductive adhesive

Author

Segerberg, Tomas ; Hedemalm, Per

Author_Institution

IVF, Molndal, Sweden

fYear

1996

Firstpage

64

Lastpage

65

Abstract

Lead is becoming an increasingly unwanted material due to its toxic qualities. The objective of this study is to find out if an alternative lead-free solder technology can be recommended given the LCA knowledge we have today. Conductive adhesive is chosen as alternative to tin-lead solder. The result depends entirely on how the environmental loads from production of silver, tin and lead are divided between these metals since in many cases they are produced simultaneously. Further, the environmental effects of silver, tin and lead waste are very uncertain. Therefore, it cannot be determined whether tin-lead solder or conductive adhesive is the best environmental alternative

Keywords

adhesion; environmental factors; soldering; Ag; SnPb; environmental effects; environmental loads; lead-free solder technology; life cycle assessment; silver-epoxy conductive adhesive; Conducting materials; Conductive adhesives; Electronics industry; Environmentally friendly manufacturing techniques; In vitro fertilization; Lead; Production; Recycling; Silver; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and the Environment, 1996. ISEE-1996., Proceedings of the 1996 IEEE International Symposium on

Conference_Location

Dallas, TX

Print_ISBN

0-7803-2950-3

Type

conf

DOI

10.1109/ISEE.1996.500399

Filename

500399