Title :
Advances and Challenges in Flip-Chip Packaging
Author :
Mahajan, R. ; Mallik, D. ; Sankman, R. ; Radhakrishnan, K. ; Chiu, C. ; He, J.
Author_Institution :
Assembly Technol., Dev. Intel Corp., Chandler, AZ
Abstract :
The role of semiconductor packaging has evolved from space transformation and environmental protection, to becoming an important enabler for silicon and system performance. This paper examines some of the advances in flip-chip packaging as an enabler of power delivery and power removal using a microprocessor as an example. In addition, the role of the package as an enabler of system I/O performance and silicon back-end reliability will be examined
Keywords :
flip-chip devices; microprocessor chips; reliability; semiconductor device packaging; flip-chip packaging; microprocessor; power delivery; power removal; semiconductor packaging; silicon back-end reliability; system I/O performance; Integrated circuit interconnections; Microelectronics; Microprocessors; Moore´s Law; Power generation; Power system protection; Semiconductor device packaging; Silicon; Space technology; Transistors;
Conference_Titel :
Custom Integrated Circuits Conference, 2006. CICC '06. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
1-4244-0075-9
Electronic_ISBN :
1-4244-0076-7
DOI :
10.1109/CICC.2006.320896
