DocumentCode
1680925
Title
Advances and Challenges in Flip-Chip Packaging
Author
Mahajan, R. ; Mallik, D. ; Sankman, R. ; Radhakrishnan, K. ; Chiu, C. ; He, J.
Author_Institution
Assembly Technol., Dev. Intel Corp., Chandler, AZ
fYear
2006
Firstpage
703
Lastpage
709
Abstract
The role of semiconductor packaging has evolved from space transformation and environmental protection, to becoming an important enabler for silicon and system performance. This paper examines some of the advances in flip-chip packaging as an enabler of power delivery and power removal using a microprocessor as an example. In addition, the role of the package as an enabler of system I/O performance and silicon back-end reliability will be examined
Keywords
flip-chip devices; microprocessor chips; reliability; semiconductor device packaging; flip-chip packaging; microprocessor; power delivery; power removal; semiconductor packaging; silicon back-end reliability; system I/O performance; Integrated circuit interconnections; Microelectronics; Microprocessors; Moore´s Law; Power generation; Power system protection; Semiconductor device packaging; Silicon; Space technology; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2006. CICC '06. IEEE
Conference_Location
San Jose, CA
Print_ISBN
1-4244-0075-9
Electronic_ISBN
1-4244-0076-7
Type
conf
DOI
10.1109/CICC.2006.320896
Filename
4115052
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