Power electronics modules for inverter applications using flip-chip on flex-circuit technology

A power packaging platform that features flex-circuit interconnection of power dies and flip-chip soldering technology has incorporated several advanced features including active gate drive technology with adjustable dv/dt control, a self-boost charge pump for the high-side gate drive power supply, and isolated giant magnetoresistive (GMR) devices for current sensing and active Tj and ΔTj. control. The packaging platform, previously demonstrated suitably for 42 V/16 A automotive applications, has been extended to 400 V/10 A inverter applications. Experimental test results demonstrate electrical performance measured under both double-pulse and 10% duty-ratio conditions. A comparison of the switching characteristics of IGBT test modules implemented with both Si and SiC free-wheeling diodes demonstrates the performance advantages that are possible with SiC power devices.