DocumentCode
1682100
Title
ATPG for heat dissipation minimization during test application
Author
Wang, Seongmoon ; Gupta, Sandeep K.
Author_Institution
Univ. of Southern California, Los Angeles, CA, USA
fYear
34608
Firstpage
250
Lastpage
258
Abstract
A new ATPG algorithm has been proposed that reduces average heat dissipation (between successive test vectors) during test application. The objective is to permit safe and inexpensive testing of low power circuits and bare dies that would otherwise require expensive heat removal equipment for testing at high speeds. Three new functions, namely transition controllability, observability and test generation costs, have been defined. It has been shown that the transition test generation cost is the minimum number of transitions required to test the corresponding stuck-at fault in fanout free circuits. This cost function is used for target fault selection while the other two functions are used to guide the backtrace and objective selection procedures of PODEM. The tests generated by the proposed ATPG decrease heat dissipation during test application by a factor of 2-23 for benchmark circuits
Keywords
CMOS integrated circuits; controllability; cooling; cost optimal control; economics; electronic engineering computing; heat sinks; integrated circuit manufacture; integrated circuit testing; logic testing; minimisation; observability; ATPG; backtrace; bare dies; benchmark circuits; fanout free circuits; heat dissipation; heat dissipation minimization; low power circuits; observability; stuck-at fault; target fault selection; test application; test generation costs; transition controllability; transition test generation cost; Automatic test pattern generation; Automatic testing; CMOS technology; Circuit faults; Circuit synthesis; Circuit testing; Cost function; Design for testability; Power dissipation; Test pattern generators;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1994. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-2103-0
Type
conf
DOI
10.1109/TEST.1994.527956
Filename
527956
Link To Document