• DocumentCode
    1682100
  • Title

    ATPG for heat dissipation minimization during test application

  • Author

    Wang, Seongmoon ; Gupta, Sandeep K.

  • Author_Institution
    Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    34608
  • Firstpage
    250
  • Lastpage
    258
  • Abstract
    A new ATPG algorithm has been proposed that reduces average heat dissipation (between successive test vectors) during test application. The objective is to permit safe and inexpensive testing of low power circuits and bare dies that would otherwise require expensive heat removal equipment for testing at high speeds. Three new functions, namely transition controllability, observability and test generation costs, have been defined. It has been shown that the transition test generation cost is the minimum number of transitions required to test the corresponding stuck-at fault in fanout free circuits. This cost function is used for target fault selection while the other two functions are used to guide the backtrace and objective selection procedures of PODEM. The tests generated by the proposed ATPG decrease heat dissipation during test application by a factor of 2-23 for benchmark circuits
  • Keywords
    CMOS integrated circuits; controllability; cooling; cost optimal control; economics; electronic engineering computing; heat sinks; integrated circuit manufacture; integrated circuit testing; logic testing; minimisation; observability; ATPG; backtrace; bare dies; benchmark circuits; fanout free circuits; heat dissipation; heat dissipation minimization; low power circuits; observability; stuck-at fault; target fault selection; test application; test generation costs; transition controllability; transition test generation cost; Automatic test pattern generation; Automatic testing; CMOS technology; Circuit faults; Circuit synthesis; Circuit testing; Cost function; Design for testability; Power dissipation; Test pattern generators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1994. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-2103-0
  • Type

    conf

  • DOI
    10.1109/TEST.1994.527956
  • Filename
    527956