DocumentCode :
1682779
Title :
Reliable Interconnect Grid for Ultra Deep Submicron
Author :
Namazi, A. ; Nourani, M. ; Saquib, M.
Author_Institution :
Center for Integrated Circuits & Syst., Texas Univ., Austin, TX
fYear :
2006
Firstpage :
107
Lastpage :
110
Abstract :
Reliability of the interconnects has become a challenge in deep submicron technology. In this paper, we propose grid communication strategy that establishes highly reliable interconnects with no length limitation. We show that using direct sequence spread spectrum and inexpensive transceivers we can transfer data with extremely low error rates. Such a highly reliable communication network is vital for future ultra deep submicron and nano systems. Experimental results are also reported to verify the concept, clarify the design procedure and measure the communication grid metrics
Keywords :
code division multiple access; nanoelectronics; network-on-chip; spread spectrum communication; telecommunication network reliability; transceivers; CDMA; communication network; direct sequence spread spectrum; grid communication; interconnect grid; interconnection reliability; submicron technology; transceivers; ultradeep submicron; Crosstalk; Integrated circuit interconnections; Integrated circuit reliability; Network-on-a-chip; Power system reliability; Semiconductor device noise; Spread spectrum communication; Telecommunication network reliability; Transceivers; Very large scale integration; CDMA; Direct Sequence Spread Spectrum; Grid Communication; Reliability; Ultra Deep Submicron;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Applications, Integration and Software, 2006 IEEE Dallas/CAS Workshop on
Conference_Location :
Richardson, TX
Print_ISBN :
1-4244-0670-6
Electronic_ISBN :
1-4244-0670-6
Type :
conf
DOI :
10.1109/DCAS.2006.321045
Filename :
4115124
Link To Document :
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