DocumentCode
1682787
Title
InTeRail: using existing and extra interconnects to test core-based SOCs
Author
Kagaris, Dimitri ; Tragoudas, Spyros
Author_Institution
Dept. of Electr. & Comput. Eng., Southern Illinois Univ., Carbondale, IL, USA
fYear
2003
Firstpage
219
Lastpage
223
Abstract
A flexible test access mechanism (TAM) for embedded cores and their interconnects in a System-on Chip (SOC) environment is presented. It targets core testing parallelism and reduced test application time while explicitly taking into consideration area and performance issues. The TAM primarily uses core interconnects but also allows for extra interconnects. The DFT hardware can be implemented either at the SOC or at the core level. It combines features of TAMs that have been designed for low test application time and those for SOC area and performance criteria.
Keywords
automatic test pattern generation; integrated circuit testing; system-on-chip; DFT hardware; InTeRail; SOCs; TAM; area overhead; core interconnect; design-for-testability; embedded core; interconnect test rail; system-on chip; test access mechanism; test application time; Application software; Circuit testing; Design for testability; Design methodology; Hardware; Integrated circuit interconnections; Parallel processing; Rails; Routing; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
On-Line Testing Symposium, 2003. IOLTS 2003. 9th IEEE
Print_ISBN
0-7695-1968-7
Type
conf
DOI
10.1109/OLT.2003.1214402
Filename
1214402
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