• DocumentCode
    1682787
  • Title

    InTeRail: using existing and extra interconnects to test core-based SOCs

  • Author

    Kagaris, Dimitri ; Tragoudas, Spyros

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Southern Illinois Univ., Carbondale, IL, USA
  • fYear
    2003
  • Firstpage
    219
  • Lastpage
    223
  • Abstract
    A flexible test access mechanism (TAM) for embedded cores and their interconnects in a System-on Chip (SOC) environment is presented. It targets core testing parallelism and reduced test application time while explicitly taking into consideration area and performance issues. The TAM primarily uses core interconnects but also allows for extra interconnects. The DFT hardware can be implemented either at the SOC or at the core level. It combines features of TAMs that have been designed for low test application time and those for SOC area and performance criteria.
  • Keywords
    automatic test pattern generation; integrated circuit testing; system-on-chip; DFT hardware; InTeRail; SOCs; TAM; area overhead; core interconnect; design-for-testability; embedded core; interconnect test rail; system-on chip; test access mechanism; test application time; Application software; Circuit testing; Design for testability; Design methodology; Hardware; Integrated circuit interconnections; Parallel processing; Rails; Routing; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    On-Line Testing Symposium, 2003. IOLTS 2003. 9th IEEE
  • Print_ISBN
    0-7695-1968-7
  • Type

    conf

  • DOI
    10.1109/OLT.2003.1214402
  • Filename
    1214402