Chip-to-package wireless power transfer and its application to mm-Wave antennas and monolithic radiometric receivers

A chip-to-package wireless power transfer concept is applied to MMIC and antennas on LCP substrate is presented. Electromagnetic simulations show the feasibility of the proposed approach. As a benchmarking topology at the working frequency of 35.4 GHz, an Archimedean spiral antenna matched to a heterogeneous transformer, which couples the power received by the antenna to the chip, has been simulated. Transistor level circuit simulations are also proposed for the LNA and the detector, which together will constitute the system-on-chip (SoC) radiometer to be integrated in the LCP-SoP.