Title :
Chip-to-package wireless power transfer and its application to mm-Wave antennas and monolithic radiometric receivers
Author :
Aluigi, L. ; Thai, T.T. ; Tentzeris, Manos M. ; Roselli, Luca ; Alimenti, F.
Author_Institution :
DIEI, Univ. of Perugia, Perugia, Italy
Abstract :
A chip-to-package wireless power transfer concept is applied to MMIC and antennas on LCP substrate is presented. Electromagnetic simulations show the feasibility of the proposed approach. As a benchmarking topology at the working frequency of 35.4 GHz, an Archimedean spiral antenna matched to a heterogeneous transformer, which couples the power received by the antenna to the chip, has been simulated. Transistor level circuit simulations are also proposed for the LNA and the detector, which together will constitute the system-on-chip (SoC) radiometer to be integrated in the LCP-SoP.
Keywords :
MMIC; low noise amplifiers; microwave power transmission; millimetre wave antennas; radiometry; spiral antennas; system-on-chip; transformers; Archimedean spiral antenna; LCP substrate; LNA; MMIC; SoC radiometer; benchmarking topology; chip-to-package wireless power transfer; electromagnetic simulation; frequency 35.4 GHz; heterogeneous transformer; mm-wave antenna; monolithic radiometric receivers; system-on-chip radiometer; transistor level circuit simulation; Antennas; Coils; Detectors; Gain; Metals; Radiometry; Substrates; Electromagnetic coupling; LNA; SoC; SoP; flexible electronics; heterogeneous integration; imaging; mm-wave;
Conference_Titel :
Radio and Wireless Symposium (RWS), 2013 IEEE
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4673-2929-3
Electronic_ISBN :
2164-2958
DOI :
10.1109/RWS.2013.6486688
