DocumentCode :
1683737
Title :
Degradation of electrical properties of organic industrial laminates due to moisture absorption
Author :
Sumangala, M.G. ; Poovamma, P.K. ; Dwarakanath, K. ; Sastry, K. S Arunachala ; Ratra, M.C.
Author_Institution :
Central Power Res. Inst., Bangalore, India
fYear :
1989
Firstpage :
484
Lastpage :
488
Abstract :
The influence on certain important electrical properties such as insulation resistance, breakdown voltage, comparative tracking index (CTI), and arc resistance in industrial organic laminates is discussed. Four different types of laminates-paper phenolic, glass-epoxy, glass-melanine, and sheet molding compounds-were selected for the investigation. The influence of araldite coating on the sides of the specimens was also investigated for some of the properties mentioned above. It is shown that glass-epoxy laminates and paper phenolic laminates exhibit very good and very poor performance, respectively. The behavior of CTI and the arc resistance of the laminates with respect to electrode material suggest that the physical processes responsible for the degradation of the material are entirely different than for the other properties. The araldite coating did not improve the properties. Instead it had an adverse effect on most of the characteristics
Keywords :
arcs (electric); composite insulating materials; electric breakdown of solids; filled polymers; insulation testing; laminates; paper; sorption; araldite coating; arc resistance; breakdown voltage; comparative tracking index; glass-epoxy; glass-melanine; insulation resistance; moisture absorption; organic industrial laminates; paper phenolic; sheet molding compounds; Electrical resistance measurement; Electrodes; Electromagnetic wave absorption; Glass; Humidity; Laminates; Moisture; Resins; Sliding mode control; Thermal degradation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Conduction and Breakdown in Solid Dielectrics, 1989., Proceedings of the 3rd International Conference on
Conference_Location :
Trondheim
Type :
conf
DOI :
10.1109/ICSD.1989.69246
Filename :
69246
Link To Document :
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