Title :
Thermal analysis for improved packaging of 4-channel 42 V/14 V DC/DC converter
Author :
Lee, Seung-Yo ; Pfaelzer, Arthur G. ; van Wyk, J.D.
Author_Institution :
Intronics Inc., Norwood, MA, USA
Abstract :
Thermal analysis for a 42 V/14 V DC/DC converter with integrated inductors is performed. An interleaved DC/DC converter system with 4-channels was chosen for the automotive converter topology with 42 V/14 V dual output voltages. Coupled inductors were designed and used for the 4-channel DC/DC converter. A 3-dimensional thermal model based on finite-element modeling (FEM) using IDEAS is presented and the thermal behavior of the DC/DC converter system is simulated and analyzed. The thermal model includes a printed circuit board, integrated inductors, a heat sink and switching devices (MOSFET). The analyzed thermal result can help to design a converter system under severe ambient temperature conditions.
Keywords :
DC-DC power convertors; automotive electronics; field effect transistor switches; finite element analysis; heat sinks; integrated circuit packaging; power inductors; power integrated circuits; power semiconductor switches; printed circuits; thermal analysis; thermal management (packaging); 14 V; 3-dimensional thermal model; 42 V; FEM; IDEAS; MOSFET; automotive converter topology; coupled inductors; finite-element modeling; heat sink; integrated inductors; interleaved bidirectional DC-DC converter; metal-oxide-semiconductor FET; printed circuit board; switching devices; thermal analysis; Analytical models; Automotive engineering; Coupling circuits; DC-DC power converters; Finite element methods; Inductors; Packaging; Performance analysis; Topology; Voltage;
Conference_Titel :
Industry Applications Conference, 2004. 39th IAS Annual Meeting. Conference Record of the 2004 IEEE
Print_ISBN :
0-7803-8486-5
DOI :
10.1109/IAS.2004.1348800
