DocumentCode
1684488
Title
Thermal design considerations in the design and application of DC-DC converters
Author
Walker, Anthony D. ; Williams, David
Author_Institution
Power Trends Inc., Batavia, IL, USA
Volume
2
fYear
1996
Firstpage
990
Abstract
Power densities and power supply components have improved such that the major obstacle in using DC-DC converters is effectively removing the heat from these devices. This paper shows practical and theoretical heat removal issues through conduction, natural convection and forced air convection. Thermal resistance and its applications are discussed. Thermal derating and how it applies to the converter is also discussed
Keywords
DC-DC power convertors; forced convection; heat sinks; natural convection; packaging; thermal analysis; thermal resistance; DC-DC converter packaging; conduction; forced air convection; heat removal; heat sinks; natural convection; power densities; power supply components; thermal derating; thermal design; thermal resistance; DC-DC power converters; Electronic packaging thermal management; Heat transfer; Integrated circuit packaging; Printed circuits; Pulse width modulation; Pulse width modulation converters; Temperature sensors; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 1996. APEC '96. Conference Proceedings 1996., Eleventh Annual
Conference_Location
San Jose, CA
Print_ISBN
0-7803-3044-7
Type
conf
DOI
10.1109/APEC.1996.500558
Filename
500558
Link To Document