DocumentCode
1684578
Title
An optimal probe testing algorithm for the connectivity verification of MCM substrates
Author
Yao, S.-Z. ; Chou, N.-C. ; Cheng, C.-K. ; Hu, T.C.
Author_Institution
California Univ., San Diego, La Jolla, CA, USA
fYear
1992
Firstpage
264
Lastpage
267
Abstract
The k-probe testing methodology is an effective approach to detect open and short faults in MCM substrates. An algorithm which generates the minimum number of tests for complete open fault coverage is proposed. For k equals two, the algorithm is able to reduce the test size by up to 50% compared with that generated by an ordinary approach. A multidimensional traveling salesman problem formulation is developed to optimize probe routes. The approach has been tested on substrate testers and has achieved excellent results.<>
Keywords
fault location; integrated circuit testing; multichip modules; optimisation; substrates; MCM substrates; connectivity verification; multidimensional traveling salesman problem; open faults; optimal probe testing algorithm; short faults; Fault location; Integrated circuit testing; Multichip modules; Optimization methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 1992. ICCAD-92. Digest of Technical Papers., 1992 IEEE/ACM International Conference on
Conference_Location
Santa Clara, CA, USA
Print_ISBN
0-8186-3010-8
Type
conf
DOI
10.1109/ICCAD.1992.279363
Filename
279363
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