• DocumentCode
    1684578
  • Title

    An optimal probe testing algorithm for the connectivity verification of MCM substrates

  • Author

    Yao, S.-Z. ; Chou, N.-C. ; Cheng, C.-K. ; Hu, T.C.

  • Author_Institution
    California Univ., San Diego, La Jolla, CA, USA
  • fYear
    1992
  • Firstpage
    264
  • Lastpage
    267
  • Abstract
    The k-probe testing methodology is an effective approach to detect open and short faults in MCM substrates. An algorithm which generates the minimum number of tests for complete open fault coverage is proposed. For k equals two, the algorithm is able to reduce the test size by up to 50% compared with that generated by an ordinary approach. A multidimensional traveling salesman problem formulation is developed to optimize probe routes. The approach has been tested on substrate testers and has achieved excellent results.<>
  • Keywords
    fault location; integrated circuit testing; multichip modules; optimisation; substrates; MCM substrates; connectivity verification; multidimensional traveling salesman problem; open faults; optimal probe testing algorithm; short faults; Fault location; Integrated circuit testing; Multichip modules; Optimization methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 1992. ICCAD-92. Digest of Technical Papers., 1992 IEEE/ACM International Conference on
  • Conference_Location
    Santa Clara, CA, USA
  • Print_ISBN
    0-8186-3010-8
  • Type

    conf

  • DOI
    10.1109/ICCAD.1992.279363
  • Filename
    279363