Title :
Minimizing quenching of plasmonic sensors caused by adhesion layers
Author :
Siegfried, T. ; Ekinci, Y. ; Solak, H. ; Martin, O.J.F. ; Sigg, H.
Author_Institution :
Paul Scherrer Inst., Villigen, Switzerland
Abstract :
Adhesion layers necessary for the robustness of plasmonic sensors are commonly used at dimensions where the electric near-field intensity can be strongly quenched. We have found that by minimizing the layer thickness to roughly 0.5 nm and by additionally controlling the geometric design of the layer, quenching can by reduced by a factor of up to 7.
Keywords :
adhesion; minimisation; nanosensors; nanostructured materials; plasmonics; quenching (thermal); adhesion layers; electric near-field intensity; layer geometric design; layer thickness; minimization; plasmonic sensor quenching; plasmonic sensor robustness; Adhesives; Chromium; Gold; Plasmons; Sensors; Titanium;
Conference_Titel :
Lasers and Electro-Optics (CLEO), 2012 Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4673-1839-6
