Electrical Performance of Electronic Packaging

fYear

2006

Abstract

The following topics are dealt with: electronic packaging; low power design; fine pitch technology; connectors; distorted serial systems; jitter; amplification; capacitance measurement; dielectric constant; dielectric loss tangent; impedance measurement; power supply system; current measurement; power distribution networks; noise suppression; switching noise; power plane noise; mixed signal systems; and I/O macromodeling

Keywords

amplification; capacitance measurement; dielectric loss measurement; electric connectors; electric current measurement; electric impedance measurement; electronics packaging; fine-pitch technology; integrated circuit modelling; jitter; low-power electronics; mixed analogue-digital integrated circuits; noise; permittivity measurement; power supply circuits; I/O macromodeling; amplification; capacitance measurement; connectors; current measurement; dielectric constant; dielectric loss tangent; distorted serial systems; electronic packaging; fine pitch technology; impedance measurement; jitter; low power design; mixed signal systems; noise suppression; power distribution networks; power plane noise; power supply system; switching noise; Capacitance measurement; Connectors; Dielectric constant; Dielectric loss measurement; Dielectric losses; Distortion; Electronics packaging; Impedance measurement; Jitter; Signal design;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2006 IEEE

Conference_Location

Scottsdale, AZ

Print_ISBN

1-4244-0668-4

Type

conf

DOI

10.1109/EPEP.2006.321169

Filename

4115328