• DocumentCode
    1687512
  • Title

    Plenary talk — Practical HTS FCL development — Updates of Innopower´s SFCL R&D projects

  • Author

    Wei Zhi Gong ; Ying Xin ; Hui Hong ; Jing Yin Zhang ; Xiao Ye Niu ; Yu Wei Sun ; Bo Tian ; Hai Zhen Wang ; Ji Bin Cui ; Li Feng Zhang ; Qiang Li ; Li Zhong Wang ; Zi Qiang Wei ; An Lin Ren

  • Author_Institution
    Innopower Supercond. Cable Co., Ltd., Beijing, China
  • fYear
    2013
  • Firstpage
    256
  • Lastpage
    256
  • Abstract
    In 2004, Innopower began the R&D work to develop saturated iron core type SFCL. The initial reasons to choose this technology are to avoid the direct impact by the quench of the superconductor coils during fault current limiting, which results in long recovery time and complicated protection requirement. The saturated iron core type SFCL have been proved to be practical and suitable for utility application from Innopower´s almost 10 year R&D practice. A 35kV/90MVA SFCL and a 220kV/300MVA SFCL were successfully manufactured, installed and operated in live grids. Now, a 500kV/1800MVA single phase prototype is under design and manufacturing. Factory tests are planned in early next year. There have been three main stages of Innopower´s SFCL R&D. The first was to build several small lab testing models to proof the basic concept and to establish the fundamental design method. The second was to design and manufacture a medium voltage device, a 35kV SFCL. The third was to developing a high voltage device, a 220kV SFCL. Each stage has some important and substantial technical progresses. The next project will be the undergoing 500kV SFCL.
  • Keywords
    fault current limiters; research and development; HTS FCL development; Innopower; SFCL R&D projects; fault current limiting; medium voltage device; superconductor coils; Conferences; Electromagnetic devices; Iron; Superconducting cables; Superconducting coils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-0068-8
  • Type

    conf

  • DOI
    10.1109/ASEMD.2013.6780758
  • Filename
    6780758