• DocumentCode
    1687697
  • Title

    Dielectric Constant and Loss Tangent Characterization of Thin High-K Dielectrics Using Corner-to-Corner Plane Probing

  • Author

    Engin, Ege ; Tambawala, A. ; Swaminathan, Madhavan ; Bhattacharya, Swapan ; Pramanik, Pranabes ; Yamazaki, Kazuhiro

  • Author_Institution
    Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2006
  • Firstpage
    29
  • Lastpage
    32
  • Abstract
    Thin dielectrics with a high dielectric constant are very attractive for improving the decoupling performance of digital and mixed-signal systems. Accurate estimation of the dielectric constant and the loss tangent is important to calculate the impedance profile or the cavity resonances. Extracting the electrical properties of thin and high-K dielectrics is difficult using conventional methods such as microstrip or ring resonators with gaps, as the coupling through the gap becomes very small for an accurate measurement. We present a method to extract the frequency-dependent dielectric constant and loss tangent of such materials using rectangular power/ground planes. We have also developed a rapid plane solver for fast extraction of material properties from such measurements. We applied this rapid solver method to characterize a thin high-K material, but we believe it can be used for thick or low-k materials as well
  • Keywords
    dielectric loss measurement; high-k dielectric thin films; permittivity measurement; probes; cavity resonances; corner-to-corner plane probing; dielectric constant; dielectric loss tangent; digital systems; electrical properties; impedance profile; material properties; microstrip resonators; mixed-signal systems; ring resonators; thin high-k dielectrics; Dielectric constant; Dielectric losses; Dielectric measurements; Electric variables measurement; High K dielectric materials; High-K gate dielectrics; Impedance; Microstrip resonators; Optical ring resonators; Resonance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2006 IEEE
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    1-4244-0668-4
  • Type

    conf

  • DOI
    10.1109/EPEP.2006.321182
  • Filename
    4115342