• DocumentCode
    1687831
  • Title

    Keynote talk — Recent development for cost-effective secondary-generation HTS tapes

  • Author

    Chuan Bing Cai

  • Author_Institution
    Phys. Dept., Shanghai Univ., Shanghai, China
  • fYear
    2013
  • Firstpage
    269
  • Lastpage
    269
  • Abstract
    In the present talk, we firstly give a brief introduction to the latest worldwide achievement on the 2nd generation high-temperature superconducting (HTS) tapes. Then we show our effort on the cost-effective approach to produce the long tapes, including the buffers prepared by electroplating method and the superconducting layers prepared by chemical solution deposition. Various distinct reel-to-reel deposition systems and technical issues are discussed with respective to the cost-effective scaling up of HTS tapes. Main concerns cover the thickness effect, rapid pyrolysis processing and pinning-related field behaviours, which are believed as the significant factors for a promising processing and industrial-level expectation of coated conductors.
  • Keywords
    MOCVD; barium compounds; critical current density (superconductivity); crystallisation; high-temperature superconductors; optical microscopy; pyrolysis; superconducting tapes; superconducting thin films; superconducting transition temperature; surface morphology; yttrium compounds; YBCO; YBCO films; chemical solution deposition; cost-effective secondary-generation HTS tapes; critical current density; crystallization; electroplating; gas consumption; high-rate decomposition process; low-fluorine solvent; modified trifluroacetates metalorganic deposition; optical microscopy; paralyzed film; phase evolution; pyrolysis ramp; resistance measurement; superconducting layers; superconducting transition temperature; surface morphology; temperature 77 K; Crystallization; Superconducting epitaxial layers; Superconducting transition temperature; Yttrium barium copper oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-0068-8
  • Type

    conf

  • DOI
    10.1109/ASEMD.2013.6780771
  • Filename
    6780771