DocumentCode
1687870
Title
Analysis of Embedded Package Capacitors for High Performance Components
Author
Muthana, Prathap ; Matoglu, Erdem ; Pham, Nam ; De Araujo, Daniel N. ; Mutnury, Bhyrav ; Cases, Moises ; Swaminathan, Madhavan
fYear
2006
Firstpage
55
Lastpage
58
Abstract
The ever increasing power requirements of processors and application specific integrated circuits (ASICs) impose stringent requirements on the design of power distribution networks (PDNs). This paper highlights a power analysis methodology and discusses the decoupling requirements of high performance components. The advantages of embedded package capacitors in core and I/O decoupling will be highlighted
Keywords
application specific integrated circuits; distribution networks; electronics packaging; embedded systems; ASIC; I/O decoupling; application specific integrated circuits; embedded package capacitors; high performance components; power distribution networks; Capacitors; Clocks; Electronics packaging; Frequency; Impedance; Integrated circuit packaging; Performance analysis; Power systems; Resonance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321189
Filename
4115349
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