Title :
Analysis of Embedded Package Capacitors for High Performance Components
Author :
Muthana, Prathap ; Matoglu, Erdem ; Pham, Nam ; De Araujo, Daniel N. ; Mutnury, Bhyrav ; Cases, Moises ; Swaminathan, Madhavan
Abstract :
The ever increasing power requirements of processors and application specific integrated circuits (ASICs) impose stringent requirements on the design of power distribution networks (PDNs). This paper highlights a power analysis methodology and discusses the decoupling requirements of high performance components. The advantages of embedded package capacitors in core and I/O decoupling will be highlighted
Keywords :
application specific integrated circuits; distribution networks; electronics packaging; embedded systems; ASIC; I/O decoupling; application specific integrated circuits; embedded package capacitors; high performance components; power distribution networks; Capacitors; Clocks; Electronics packaging; Frequency; Impedance; Integrated circuit packaging; Performance analysis; Power systems; Resonance; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321189
