DocumentCode
1688028
Title
Genetic Algorithms with Scalable I/O Macromodels to Find the Worst Case Corner in High-Speed Server Electrical Analysis
Author
Mutnury, Bhyrav ; Cases, Moises ; Pham, Nam ; De Araujo, Daniel N. ; Matoglu, Erdem
Author_Institution
xSeries eServer Dev., Austin, TX
fYear
2006
Firstpage
73
Lastpage
76
Abstract
Performing time domain electrical analysis on high-seed high-end server systems is exhaustive in terms of simulation time consumed and CPU memory. There have been many macromodeling techniques proposed in the past to model both the active and passive components of an electrical interface. These macromodels help in reducing the simulation time and CPU memory consumption while maintaining the accuracy. A full blown design space exploration is needed to find the worst case corner(s) of an electrical interface. The number of simulations needed for this would be in the order of thousands. Performing these simulations, even with scalable I/O macromodels, is cumbersome and parsing the output data from these simulations is equally tedious. In this paper, a genetic algorithm (GA) based approach is described to find the worst case corner(s) in highspeed server electrical analysis. It has been shown that by using GA based approach the worst case corner(s) can be estimated without performing a full-blown Monte Carlo sweep. Scalable I/O macromodels are used along with GA based approach to enhance the efficiency of the proposed technique
Keywords
circuit optimisation; genetic algorithms; queueing theory; time-domain synthesis; CPU memory; genetic algorithms; high seed high end server systems; high speed server electrical analysis; scalable I/O macromodels; simulation time; time domain electrical analysis; worst case corner; Algorithm design and analysis; Central Processing Unit; Circuit simulation; Driver circuits; Genetic algorithms; Monte Carlo methods; Performance analysis; Space exploration; Time domain analysis; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321194
Filename
4115354
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