• DocumentCode
    1688028
  • Title

    Genetic Algorithms with Scalable I/O Macromodels to Find the Worst Case Corner in High-Speed Server Electrical Analysis

  • Author

    Mutnury, Bhyrav ; Cases, Moises ; Pham, Nam ; De Araujo, Daniel N. ; Matoglu, Erdem

  • Author_Institution
    xSeries eServer Dev., Austin, TX
  • fYear
    2006
  • Firstpage
    73
  • Lastpage
    76
  • Abstract
    Performing time domain electrical analysis on high-seed high-end server systems is exhaustive in terms of simulation time consumed and CPU memory. There have been many macromodeling techniques proposed in the past to model both the active and passive components of an electrical interface. These macromodels help in reducing the simulation time and CPU memory consumption while maintaining the accuracy. A full blown design space exploration is needed to find the worst case corner(s) of an electrical interface. The number of simulations needed for this would be in the order of thousands. Performing these simulations, even with scalable I/O macromodels, is cumbersome and parsing the output data from these simulations is equally tedious. In this paper, a genetic algorithm (GA) based approach is described to find the worst case corner(s) in highspeed server electrical analysis. It has been shown that by using GA based approach the worst case corner(s) can be estimated without performing a full-blown Monte Carlo sweep. Scalable I/O macromodels are used along with GA based approach to enhance the efficiency of the proposed technique
  • Keywords
    circuit optimisation; genetic algorithms; queueing theory; time-domain synthesis; CPU memory; genetic algorithms; high seed high end server systems; high speed server electrical analysis; scalable I/O macromodels; simulation time; time domain electrical analysis; worst case corner; Algorithm design and analysis; Central Processing Unit; Circuit simulation; Driver circuits; Genetic algorithms; Monte Carlo methods; Performance analysis; Space exploration; Time domain analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2006 IEEE
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    1-4244-0668-4
  • Type

    conf

  • DOI
    10.1109/EPEP.2006.321194
  • Filename
    4115354