A Preconditioned Hierarchical Algorithm for Impedance Extraction of Interconnects in Packages

Author

Yi, Yang ; Li, Peng ; Sarin, Vivek ; Shi, Weiping

Author_Institution

Dept. of Electr. & Comput. Eng., Texas A & M Univ., College Station, TX

fYear

2006

Firstpage

99

Lastpage

102

Abstract

This algorithm is based on the boundary element method, accelerated by the hierarchical data structure and efficient preconditioning through sparsification. It is the first kernel independent BEM algorithm for impedance extraction, and also the first to use efficient preconditioners for impedance extraction. As a result, this algorithm is much faster than previous algorithms for both uniform and multilayer dielectric. Experimental results also show the extracted impedance is very accurate compared with FastImp

Keywords

boundary-elements methods; dielectric materials; electric impedance measurement; integrated circuit interconnections; integrated circuit packaging; boundary element method; hierarchical data structure; integrated circuit interconnections; integrated circuit packaging; interconnect impedance extraction; kernel independent BEM algorithm; multilayer dielectric; preconditioned hierarchical algorithm; Boundary element methods; Conductors; Data mining; Data structures; Dielectrics; Electronics packaging; Impedance; Kernel; Linear systems; Nonhomogeneous media;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2006 IEEE

Conference_Location

Scottsdale, AZ

Print_ISBN

1-4244-0668-4

Type

conf

DOI

10.1109/EPEP.2006.321201

Filename

4115361