Title :
A Preconditioned Hierarchical Algorithm for Impedance Extraction of Interconnects in Packages
Author :
Yi, Yang ; Li, Peng ; Sarin, Vivek ; Shi, Weiping
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas A & M Univ., College Station, TX
Abstract :
This algorithm is based on the boundary element method, accelerated by the hierarchical data structure and efficient preconditioning through sparsification. It is the first kernel independent BEM algorithm for impedance extraction, and also the first to use efficient preconditioners for impedance extraction. As a result, this algorithm is much faster than previous algorithms for both uniform and multilayer dielectric. Experimental results also show the extracted impedance is very accurate compared with FastImp
Keywords :
boundary-elements methods; dielectric materials; electric impedance measurement; integrated circuit interconnections; integrated circuit packaging; boundary element method; hierarchical data structure; integrated circuit interconnections; integrated circuit packaging; interconnect impedance extraction; kernel independent BEM algorithm; multilayer dielectric; preconditioned hierarchical algorithm; Boundary element methods; Conductors; Data mining; Data structures; Dielectrics; Electronics packaging; Impedance; Kernel; Linear systems; Nonhomogeneous media;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321201
