Title :
Crosstalk Superposition of Multiple Aggressors in Electronic Package System Pre-PD Signal Integrity Simulations
Author_Institution :
IBM Corp., Poughkeepsie, NY
Abstract :
A new method of crosstalk superposition of multiple aggressors is proposed to make the system pre-PD signal integrity simulations simpler, easier, and faster. The new method uses a single virtual aggressor to represent multiple aggressors based on the concept of directional junction. The accuracy of this method is verified by comparing the simulated waveforms with those by conventional method in both single ended and differential applications. This method is for general-purpose circuit/system simulation tools and can be applied to multi-coupled transmission line models as well as component quasi-static and fullwave models
Keywords :
circuit simulation; crosstalk; integrated circuit packaging; component fullwave models; component quasistatic models; crosstalk superposition; directional junction; electronic package system; multicoupled transmission line models; multiple aggressors; pre-PD signal integrity simulations; virtual aggressor; Bit error rate; Circuit simulation; Crosstalk; Distributed parameter circuits; Electronics packaging; Network-on-a-chip; Signal analysis; Timing; Transmission lines; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321205
