DocumentCode
1688362
Title
Crosstalk Superposition of Multiple Aggressors in Electronic Package System Pre-PD Signal Integrity Simulations
Author
Chen, Zhaoqing
Author_Institution
IBM Corp., Poughkeepsie, NY
fYear
2006
Firstpage
115
Lastpage
118
Abstract
A new method of crosstalk superposition of multiple aggressors is proposed to make the system pre-PD signal integrity simulations simpler, easier, and faster. The new method uses a single virtual aggressor to represent multiple aggressors based on the concept of directional junction. The accuracy of this method is verified by comparing the simulated waveforms with those by conventional method in both single ended and differential applications. This method is for general-purpose circuit/system simulation tools and can be applied to multi-coupled transmission line models as well as component quasi-static and fullwave models
Keywords
circuit simulation; crosstalk; integrated circuit packaging; component fullwave models; component quasistatic models; crosstalk superposition; directional junction; electronic package system; multicoupled transmission line models; multiple aggressors; pre-PD signal integrity simulations; virtual aggressor; Bit error rate; Circuit simulation; Crosstalk; Distributed parameter circuits; Electronics packaging; Network-on-a-chip; Signal analysis; Timing; Transmission lines; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321205
Filename
4115365
Link To Document