• DocumentCode
    1688446
  • Title

    Analysis of temperature rise in reactors using coupled multi-physics simulations

  • Author

    Yu Jiao Zhang ; Wei Nan Qin ; Gang Liang Wu ; Jiang Jun Ruan ; Tao Huang

  • Author_Institution
    Coll. of Electr. Eng. & New Energy, China Three Gorges Univ., Yichang, China
  • fYear
    2013
  • Firstpage
    363
  • Lastpage
    366
  • Abstract
    The ventilation system design of dry-type air-core reactor is a complex task that must determine the thermal loads to achieve the maximum insulation material exploitation. In this paper, the temperature rise in reactor is due to Joule´s losses and heat dissipation by air convection, convection and radiation. The Joule´s losses calculated by coupled magnetic field-circuit analysis are used as the input for the thermal field by finite-element analysis, which is directly coupled with fluid analysis. Finally, the temperature distributions of reactor can be calculated. Therefore, the thermal performance analysis of air-core reactor could be conducted in the early design stage to guarantee the insulation material requirements.
  • Keywords
    finite element analysis; heat losses; insulating materials; magnetic circuits; reactors (electric); temperature distribution; temperature measurement; ventilation; Joule losses; air convection; air radiation; coupled magnetic field circuit analysis; coupled multiphysics simulation; dry type air core reactor; finite element analysis; fluid analysis; heat dissipation; insulation material exploitation; temperature distribution; temperature rise analysis; thermal field; thermal load determination; thermal performance analysis; ventilation system design; Conductors; Finite element analysis; Fluids; Heating; Inductors; Mathematical model; Windings; coupled magnetic field-circuit; dry-type air-core reactor; finite-element analysis; fluid field; temperature rise; thermal field;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-0068-8
  • Type

    conf

  • DOI
    10.1109/ASEMD.2013.6780795
  • Filename
    6780795