DocumentCode
1688609
Title
Analytical Estimation of Interconnect Loss Due to Dummy Fills
Author
Tsuchiya, Akira ; Onodera, Hidetoshi
Author_Institution
Dept. of Commun. & Comput. Eng., Kyoto Univ.
fYear
2006
Firstpage
149
Lastpage
152
Abstract
This paper proposes an analytical method to estimate the interconnect loss due to dummy fills. By modeling the eddy current in dummy fills as a simple square loop, the authors derive the impact of dummy fills on the loss of interconnect. The authors verified the proposed method by a 3D field solver. Experimental results show that the proposed method provides accurate modeling of the effect of dummy fills
Keywords
eddy current losses; estimation theory; integrated circuit interconnections; integrated circuit modelling; 3D field solver; analytical estimation; dummy fills; eddy current; interconnect loss; square loop; Conductors; Eddy currents; Electronics packaging; Frequency; Large scale integration; Optical device fabrication; Optical losses; Performance analysis; Performance loss; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321214
Filename
4115374
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