Title :
Analytical Estimation of Interconnect Loss Due to Dummy Fills
Author :
Tsuchiya, Akira ; Onodera, Hidetoshi
Author_Institution :
Dept. of Commun. & Comput. Eng., Kyoto Univ.
Abstract :
This paper proposes an analytical method to estimate the interconnect loss due to dummy fills. By modeling the eddy current in dummy fills as a simple square loop, the authors derive the impact of dummy fills on the loss of interconnect. The authors verified the proposed method by a 3D field solver. Experimental results show that the proposed method provides accurate modeling of the effect of dummy fills
Keywords :
eddy current losses; estimation theory; integrated circuit interconnections; integrated circuit modelling; 3D field solver; analytical estimation; dummy fills; eddy current; interconnect loss; square loop; Conductors; Eddy currents; Electronics packaging; Frequency; Large scale integration; Optical device fabrication; Optical losses; Performance analysis; Performance loss; Wires;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321214
