• DocumentCode
    1688609
  • Title

    Analytical Estimation of Interconnect Loss Due to Dummy Fills

  • Author

    Tsuchiya, Akira ; Onodera, Hidetoshi

  • Author_Institution
    Dept. of Commun. & Comput. Eng., Kyoto Univ.
  • fYear
    2006
  • Firstpage
    149
  • Lastpage
    152
  • Abstract
    This paper proposes an analytical method to estimate the interconnect loss due to dummy fills. By modeling the eddy current in dummy fills as a simple square loop, the authors derive the impact of dummy fills on the loss of interconnect. The authors verified the proposed method by a 3D field solver. Experimental results show that the proposed method provides accurate modeling of the effect of dummy fills
  • Keywords
    eddy current losses; estimation theory; integrated circuit interconnections; integrated circuit modelling; 3D field solver; analytical estimation; dummy fills; eddy current; interconnect loss; square loop; Conductors; Eddy currents; Electronics packaging; Frequency; Large scale integration; Optical device fabrication; Optical losses; Performance analysis; Performance loss; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2006 IEEE
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    1-4244-0668-4
  • Type

    conf

  • DOI
    10.1109/EPEP.2006.321214
  • Filename
    4115374