Title :
Simulation, Measurement and Modeling of Orthogonal On-Chip Interconnects
Author :
Quere, Yves ; Gouguec, Thierry ; Martin, Pierre-marie ; Berre, Denis ; Huret, Fabrice
Author_Institution :
LEST-UMR CNRS, Brest Cedex
Abstract :
This paper explains the appearance of resonant frequency due to underlayer orthogonal metal grid in microstrip line structures. In the context of global interconnects, this resonant frequency may lead to noise and has to be estimate. A model, which allows one to approximate this resonant frequency, is validated by measurement
Keywords :
integrated circuit interconnections; integrated circuit modelling; microstrip lines; microstrip line structures; orthogonal metal grid underlay; orthogonal on-chip interconnects; resonant frequency; CMOS technology; Circuit noise; Copper; Electronics packaging; Frequency measurement; Gold; Integrated circuit interconnections; Microstrip; Resonant frequency; Turing machines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321215
