DocumentCode
1688674
Title
Simulation, Measurement and Modeling of Orthogonal On-Chip Interconnects
Author
Quere, Yves ; Gouguec, Thierry ; Martin, Pierre-marie ; Berre, Denis ; Huret, Fabrice
Author_Institution
LEST-UMR CNRS, Brest Cedex
fYear
2006
Firstpage
153
Lastpage
156
Abstract
This paper explains the appearance of resonant frequency due to underlayer orthogonal metal grid in microstrip line structures. In the context of global interconnects, this resonant frequency may lead to noise and has to be estimate. A model, which allows one to approximate this resonant frequency, is validated by measurement
Keywords
integrated circuit interconnections; integrated circuit modelling; microstrip lines; microstrip line structures; orthogonal metal grid underlay; orthogonal on-chip interconnects; resonant frequency; CMOS technology; Circuit noise; Copper; Electronics packaging; Frequency measurement; Gold; Integrated circuit interconnections; Microstrip; Resonant frequency; Turing machines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321215
Filename
4115375
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