• DocumentCode
    1688717
  • Title

    Design, fabrication, and characterization of piezoresisitve strain gage-based pressure sensors for mechatronic systems

  • Author

    Seungwoo Ham ; Kibeom Kim ; Jinwoong Kim ; Min, Namki ; Wooseok Choi ; Chanwon Park

  • Author_Institution
    Dept. of Control & Instrum. Eng., Korea Univ., Sejong, South Korea
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The pressure sensor is a key device in many mechatronic systems for automotive and industrial applications. We represent the piezoresitive pressure sensor based on the single crystal silicon strain gauges, which are glass-fused to the stainless steel diaphragm at high temperature. The silicon bulkmicromachined strain gauges have the through holes and the closed structure, unlike the current competitive devices with open structure. This unique design concept reduces shifting or rotation of gauge position during glass frit bonding and enables the automation of alignment and bonding processes, which improves the sensor performance and yield and hence reduces sensor cost. The prototype was characterized using specific long term tests such as PPTCB (pulsed pressure, temperature cycling, with bias). The pressure sensors tested under pressure ranging from 0 to 50 bar at different temperature have a linear output with a typical sensitivity of about 16mV/V/bar and an offset drift of -6 mV to 2 mV. The fatigue life tests run at a rate of 3 Hz up to 2 million pressure cycles from 0 to 50 bar showed no failures when the pressure cycle test was stopped.
  • Keywords
    fatigue testing; micromachining; microsensors; piezoresistive devices; pressure sensors; strain gauges; strain sensors; fatigue life tests; mechatronic systems; piezoresistive strain gauge-based pressure sensors; pressure 0 bar to 50 bar; silicon bulk micromachined strain gauges; single crystal silicon strain gauges; stainless steel diaphragm; Glass; Sensitivity; Silicon; Steel; Strain; Temperature sensors; Strain gauge; bulk micromachining; glass frit bonding; pressure sensor; steel diaphragm;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Control, Measurement, Signals and their Application to Mechatronics (ECMSM), 2015 IEEE International Workshop of
  • Conference_Location
    Liberec
  • Print_ISBN
    978-1-4799-6970-8
  • Type

    conf

  • DOI
    10.1109/ECMSM.2015.7208680
  • Filename
    7208680