• DocumentCode
    1688789
  • Title

    OpticTM the new generation of microoptical subassemblies

  • Author

    Weigert, M. ; Bittner, Matthias

  • Author_Institution
    Dept. of Fiber Opt. Eng., Infineon Technol., Regensburg
  • fYear
    1999
  • fDate
    6/21/1905 12:00:00 AM
  • Firstpage
    42491
  • Lastpage
    42496
  • Abstract
    Past experiences in “back-end-technology” has shown that a plastic package is the key to cost reduction which gives the customer advantages. Most of optical subassemblies are packaged in TO-cans because of they are hermetically leak proof, gives light guidance in air, and because of the higher expansions coefficient of plastics etc. The development of a new submount technology, as well as known plastic packaging techniques and experience in fiber coupling, offers the possibility of combination the existing know how in one company. The production of integrated submounts, batch assembly, leadframe, mold techniques and optical coupling will be described in the following paper. Furthermore, first results will be shown and give an overview of the possibilities which are offered by the new package
  • Keywords
    plastic packaging; TO-cans; back-end-technology; batch assembly; cost reduction; customer advantages; fiber coupling; hermetically leak proof; integrated submounts; leadframe techniques; microoptical subassemblies; mold techniques; optical coupling; optical subassemblies; overview; plastic package; plastic packaging technique; submount technology;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Microengineering in Optics and Optoelectronics (Ref. No. 1999/187), IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1049/ic:19990866
  • Filename
    827116