DocumentCode
1688789
Title
OpticTM the new generation of microoptical subassemblies
Author
Weigert, M. ; Bittner, Matthias
Author_Institution
Dept. of Fiber Opt. Eng., Infineon Technol., Regensburg
fYear
1999
fDate
6/21/1905 12:00:00 AM
Firstpage
42491
Lastpage
42496
Abstract
Past experiences in “back-end-technology” has shown that a plastic package is the key to cost reduction which gives the customer advantages. Most of optical subassemblies are packaged in TO-cans because of they are hermetically leak proof, gives light guidance in air, and because of the higher expansions coefficient of plastics etc. The development of a new submount technology, as well as known plastic packaging techniques and experience in fiber coupling, offers the possibility of combination the existing know how in one company. The production of integrated submounts, batch assembly, leadframe, mold techniques and optical coupling will be described in the following paper. Furthermore, first results will be shown and give an overview of the possibilities which are offered by the new package
Keywords
plastic packaging; TO-cans; back-end-technology; batch assembly; cost reduction; customer advantages; fiber coupling; hermetically leak proof; integrated submounts; leadframe techniques; microoptical subassemblies; mold techniques; optical coupling; optical subassemblies; overview; plastic package; plastic packaging technique; submount technology;
fLanguage
English
Publisher
iet
Conference_Titel
Microengineering in Optics and Optoelectronics (Ref. No. 1999/187), IEE Colloquium on
Conference_Location
London
Type
conf
DOI
10.1049/ic:19990866
Filename
827116
Link To Document