Title :
3D micro-optomechanical devices by surface tension powered self-assembly
Author :
Syms, Richard R. A.
Author_Institution :
Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London
fDate :
6/21/1905 12:00:00 AM
Abstract :
Surface tension self-assembly has been shown to be a versatile technique for accurate, massparallel assembly of 3D microengineered structures. It is particularly suited for construction of devices which require features to be patterned and set up out of the wafer plane, such as opto-MEMS devices. However, analogous applications exist for beam processing elements in microengineered electron and ion optical systems
Keywords :
surface tension; 3D micro-optomechanical devices; 3D microengineered structures; accurate massparallel assembly; analogous applications; beam processing elements; ion optical systems; microengineered electron systems; opto-MEMS devices; patterned feature devices; surface tension powered self-assembly; surface tension self-assembly; wafer plane;
Conference_Titel :
Microengineering in Optics and Optoelectronics (Ref. No. 1999/187), IEE Colloquium on
Conference_Location :
London
DOI :
10.1049/ic:19990865
