Title :
Deformation sensitivity mechanisms of molybdenum-silicon Schottky diodes
Author :
Fastykovsky, Pevpel P.
Author_Institution :
Mechnikov State Univ., Odessa, Ukraine
Abstract :
The influence of uniaxial deformation on Mo-nn+Si Schottky diode reverse I-U characteristics has been investigated. Strain sensitivity of the reverse current is shown to be connected with the degree of imperfection of the silicon layer near the surface. The highest strain sensitivity is found in the diodes, whose silicon layer near the surface contains local dislocation clusters of increased density. This is associated with the resonant tunneling current flowing in the diodes, whose dependence on the strain and bias voltage is stronger than that of the thermionic current
Keywords :
Schottky-barrier diodes; deformation; molybdenum; semiconductor device testing; semiconductor materials; silicon; Mo-Si; Schottky diodes; bias voltage; local dislocation clusters; resonant tunneling current; reverse I-U characteristics; reverse current; semiconductor device testing; strain sensitivity; thermionic current; uniaxial deformation; Capacitive sensors; Fabrication; Production; Resonant tunneling devices; Schottky diodes; Silicon; Strain measurement; Temperature distribution; Temperature sensors; Voltage;
Conference_Titel :
Industrial Electronics, 1992., Proceedings of the IEEE International Symposium on
Conference_Location :
Xian
Print_ISBN :
0-7803-0042-4
DOI :
10.1109/ISIE.1992.279618