Characterization of multiple-via interconnections for multilayer chip and module designs

Author

Huang, C.-W.P. ; Hammadi, S. ; Lott, J. ; Al-Kuran, S.

Author_Institution

Anadigics Inc., Warren, NJ, USA

Volume

1

fYear

2001

Firstpage

338

Abstract

In this paper, multiple via interconnects for multilayer IC and PCB applications are accurately modeled using full-wave electromagnetic simulations. The same test structures were also characterized with measurements. We have shown good agreement between simulated and measured data over a wide frequency band. Methods for accurate equivalent circuit model extraction of coupled vias are also presented.

Keywords

equivalent circuits; integrated circuit interconnections; multichip modules; printed circuit design; MCM; MoM; coupled vias; die grounding; equivalent circuit model; frequency band; full-wave electromagnetic simulations; heat sinking; method of moment; multichip modules; multilayer IC; multilayer PCB; multilayer chip design; multilayer module design; multiple-via interconnections; simulated data; test structures; Application specific integrated circuits; Circuit simulation; Circuit testing; Electromagnetic measurements; Electromagnetic modeling; Equivalent circuits; Frequency measurement; Integrated circuit interconnections; Integrated circuit modeling; Nonhomogeneous media;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2001. IEEE

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7070-8

Type

conf

DOI

10.1109/APS.2001.958862

Filename

958862