Title :
High-k Hf-Based Nanocrystal Memory Capacitors with IrOx Metal Gate for NAND Application
Author :
Banerjee, W. ; Maikap, S.
Author_Institution :
Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
Abstract :
The memory characteristics of atomic layer deposited high-kappa Hf-based nanocrystals embedded in high-kappa Al2O3 films in an n-Si/SiO2/HfO2/high-k nanocrystal/Al2O3/IrOx memory structure have been investigated. The high-k nanocrystals can be formed after high temperature (> 900degC) annealing process. The high-k nanocrystal memory devices with a small EOT of ~8 nm show a large hysteresis memory window of DeltaV ap 3.8 V at a sweeping gate voltage of plusmn9 V, 0.2 s. A hysteresis memory window of 0.9 V has also been observed under a small sweeping gate voltage of plusmn7 V. A good uniformity of the high-k nanocrystal memory devices is also observed. A large memory window of >2 V and a low charge loss of 14% are achieved after ~8 times 105 s (9 days) of retention time owing to the charge confinement in the high-k nanocrystals.
Keywords :
NAND circuits; aluminium compounds; atomic layer deposition; capacitors; Al2O3; IrOx; NAND application; atomic layer deposition; high-k nanocrystals; metal gate; nanocrystal memory capacitors; Annealing; Atomic layer deposition; Capacitors; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Hysteresis; Nanocrystals; Temperature; Voltage; Al2O3; HfAlO; HfO2; atomic layer depositio; endurance; high-k nanocrystal; nonvolatile flash memory; retention;
Conference_Titel :
Memory Technology, Design, and Testing, 2009. MTDT '09. IEEE International Workshop on
Conference_Location :
Hsinchu
Print_ISBN :
978-0-7695-3797-9
DOI :
10.1109/MTDT.2009.15