• DocumentCode
    1689516
  • Title

    Prospect for application of superconducting fault current limiter in Chinese power grid

  • Author

    Wei Li ; Xue Nan Li ; Bin Shu ; Kai Zhang ; Zhao Yan Liu ; Qi He Lou ; Yu Liu ; Bao Qing Yao

  • Author_Institution
    Beijing Electr. Power Econ-Tech Res. Inst., Beijing, China
  • fYear
    2013
  • Firstpage
    513
  • Lastpage
    516
  • Abstract
    Development of strong and smart electric power grids requires better solutions for short-circuit fault current control. Besides system optimization, effective fault current limiting hardware will provide meaningful options for utilities to deal with fault current control. Superconducting fault current limiter (SFCL) has superior properties as a fault current limiting device. An SFCL can have very low impedance during normal power transmission, resulting in exceptional low voltage drop on the device and very low transmission loss. When a short-circuit fault takes place, it automatically turns to high impedance, suppressing the magnitude of the fault current. This paper will discuss the prospects of SFCLs in various kinds of power grids and the design requirements for SFCLs in different applications.
  • Keywords
    electric current control; optimisation; power transmission control; short-circuit currents; smart power grids; superconducting fault current limiters; Chinese power grid; SFCL; current 63 kA; design requirements; fault current magnitude suppression; low voltage drop; normal power transmission; short-circuit fault current control; smart electric power grids; superconducting fault current limiter; system optimization; very low impedance; very low transmission loss; voltage 220 kV; voltage 500 kV; Circuit breakers; Fault currents; Limiting; Power grids; Short-circuit currents; Substations; Superconducting transmission lines; fault current; fault current limiter; power grid; superconductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-0068-8
  • Type

    conf

  • DOI
    10.1109/ASEMD.2013.6780833
  • Filename
    6780833