Title :
Study on the simplified distributed parameter model for HTS power cables
Author :
Bin Shu ; Xue Liang Ma ; Xiao Peng Han ; Jiang Tao Li ; Zhi Jie Zhao ; Zheng Liang ; Jian Hao Li
Author_Institution :
Beijing Power Eco-Tech Res. Inst., Beijing, China
Abstract :
Nowadays, the power demand has been dramatically increasing in highly populated load centers. The high-temperature superconductor (HTS) cables are one possible solution for electricity transmission due to their higher transmission capacity and lower electrical loss compared with traditional power cables. A comprehensive and accurate model is very important for working condition prediction in order for power flow control and overvoltage protection, especially for HTS cable which is very expensive and lacking of operation experience. In this paper, a simplified model for HTS cable is described to further facilitate operating condition simulations. The self-, mutual inductances, capacitances of and between each layer are calculated to construct the parameter matrixes. By proper transformation, the electrical parameters matrixes can be represented by simplified PI sections. Uniform current distribution in conductor layers is always desired. The simplified distributed parameters model presented in this paper is also helpful for structure optimization to achieve uniform current distribution in conductor layers.
Keywords :
capacitance; current distribution; high-temperature superconductors; inductance; superconducting cables; HTS power cables; conductor layers; electricity transmission; high-temperature superconductor cables; lower electrical loss; overvoltage protection; power flow control; simplified PI sections; simplified distributed parameter model; traditional power cables; transmission capacity; uniform current distribution; Cable shielding; Conductors; High-temperature superconductors; Inductance; Integrated circuit modeling; Power cables; Superconducting cables; HTS cables; current distribution; simplified model;
Conference_Titel :
Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013 IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-0068-8
DOI :
10.1109/ASEMD.2013.6780836