• DocumentCode
    1689593
  • Title

    Common Mode Return Loss Consideration in Wirebond Packaging for High Speed SerDes Links

  • Author

    Nanju Na ; Arseneault, Marcel ; Yonehara, Katsuyuki ; Hu, Haitian ; Zwitter, Deborah ; Wolf, Edward M. ; Srinivasan, Krishna ; Cox, Carrie ; Anderson, Richard

  • fYear
    2006
  • Firstpage
    257
  • Lastpage
    260
  • Abstract
    This paper discusses the trade-offs in performance and cost of high speed SerDes in wirebond package applications. While many protocol standards specify requirements for both common mode return loss and differential mode return loss, meeting both sets of requirements in low cost wirebond packages requires the designer to make significant trade-offs. The performance and cost impacts of improving common mode return loss in wirebond packaging is examined from several different points of view
  • Keywords
    integrated circuit bonding; integrated circuit packaging; lead bonding; common mode return loss; differential mode return loss; high speed SerDes links; protocol standards; wirebond packaging; Costs; Electromagnetic interference; Impedance; Integrated circuit interconnections; Noise generators; Packaging; Performance loss; Reflection; Signal design; Stripline;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2006 IEEE
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    1-4244-0668-4
  • Type

    conf

  • DOI
    10.1109/EPEP.2006.321243
  • Filename
    4115403