DocumentCode
1689593
Title
Common Mode Return Loss Consideration in Wirebond Packaging for High Speed SerDes Links
Author
Nanju Na ; Arseneault, Marcel ; Yonehara, Katsuyuki ; Hu, Haitian ; Zwitter, Deborah ; Wolf, Edward M. ; Srinivasan, Krishna ; Cox, Carrie ; Anderson, Richard
fYear
2006
Firstpage
257
Lastpage
260
Abstract
This paper discusses the trade-offs in performance and cost of high speed SerDes in wirebond package applications. While many protocol standards specify requirements for both common mode return loss and differential mode return loss, meeting both sets of requirements in low cost wirebond packages requires the designer to make significant trade-offs. The performance and cost impacts of improving common mode return loss in wirebond packaging is examined from several different points of view
Keywords
integrated circuit bonding; integrated circuit packaging; lead bonding; common mode return loss; differential mode return loss; high speed SerDes links; protocol standards; wirebond packaging; Costs; Electromagnetic interference; Impedance; Integrated circuit interconnections; Noise generators; Packaging; Performance loss; Reflection; Signal design; Stripline;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321243
Filename
4115403
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