DocumentCode
1689831
Title
A Framework And Simulator for Parallel Fast Integral Equation Simulation of Microelectronic Structures
Author
Jandhyala, Vikram ; Yang, Chuanyi ; Chakraborty, Shiladri ; Chowdhury, Ranil ; Pingenot, James ; Williams, Doug
Author_Institution
Adv. Comput. Eng. Lab, Washington Univ.
fYear
2006
Firstpage
287
Lastpage
290
Abstract
As a part of IBM´s special session, this paper presents a framework and integral equation-based 3D electromagnetic simulator for parallel simulation of microelectronic structures including those of interest to IBM. The translators, mesher, and simulator is described and is validated for initial cases. Progress on the IBM benchmark is reported
Keywords
circuit simulation; computational electromagnetics; integral equations; integral equation-based 3D electromagnetic simulator; microelectronic structures; parallel fast integral equation simulation; Circuit simulation; Computational modeling; Concurrent computing; Data structures; Electronics packaging; Green´s function methods; Integral equations; Iterative algorithms; Matrix decomposition; Microelectronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321157
Filename
4115411
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