DocumentCode
1689844
Title
Large Scale Simulation of an Integrated Circuit Package
Author
Gjonaj, E. ; Perotoni, M. ; Weiland, T.
Author_Institution
Inst. fur Theoric Elektromagnetischer Felder, Technische Univ. Darmstadt
fYear
2006
Firstpage
291
Lastpage
294
Abstract
A full-wave parallel simulation of a complete IC package is performed. The simulation is based on a specialized domain decomposition method which allows for highly balanced parallel computations. Preliminary results including signal wave forms and delay times are given
Keywords
circuit simulation; integrated circuit packaging; full-wave parallel simulation; integrated circuit package; large scale simulation; Circuit simulation; Computational modeling; Distributed computing; Electronics packaging; Frequency; Geometry; Integrated circuit modeling; Integrated circuit packaging; Large scale integration; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321158
Filename
4115412
Link To Document