Title :
Large Scale Signal and Interconnect FDTD Modeling for BGA Package
Author :
Chen, Xiaohe ; Drewniak, James L. ; Zhang, Jianmin ; Cracraft, Michael ; Archambeault, Bruce ; Connor, Samuel
Author_Institution :
Dept of Electr. & Comput. Eng., Missouri Univ., Rolla, MO
Abstract :
This paper introduces a finite-difference time-domain (FDTD) approach to modeling portions of ball grid array (BGA) package interconnect circuits. A full wave circuit model including vias, trace segments, and ground vias was generated, using a computer gridding tool, and fed into the FDTD (Taflove and Hagness, 2005) program. The simulated results were correlated with TDR measurements
Keywords :
ball grid arrays; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit modelling; BGA package; ball grid array package interconnect circuits; computer gridding tool; finite-difference time-domain approach; full wave circuit model; large scale interconnect FDTD modeling; large scale signal FDTD modeling; Circuit simulation; Data mining; Dielectrics; Electronics packaging; Finite difference methods; Integrated circuit interconnections; Large-scale systems; Mesh generation; Solid modeling; Time domain analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0668-4
DOI :
10.1109/EPEP.2006.321160
