Title :
A SPICE based thermal model for the estimation of peak current capability of thyristor based devices
Author :
Wilson, R. ; Scott, P.W.R. ; Moult, R.H. ; Gamble, H.S. ; Hudson, A.S.
Author_Institution :
Dept. of Electron. Eng., Queen´´s Univ., Belfast, UK
Abstract :
A thermal model of a thyristor, using an electrical analogue to heat flow in a layer, developed for use in the prediction of peak current capability of p-n-p-n devices, is presented. For any given current, a power waveform, representing the total power dissipated in the device for that current, is generated. This is then distributed over three heat sources representing the main locations of heat generation in an actual device. Comparisons with published data and experimental results yield close agreement with model predictions, indicating the validity of the approach. The model has also been used successfully in the development of thyristor based surge protectors
Keywords :
SPICE; digital simulation; electronic engineering computing; semiconductor device models; thermal analysis; thyristors; SPICE; development; digital simulation; heat sources; p-n-p-n devices; peak current capability; power dissipation; power waveform; semiconductor device models; surge protectors; thermal analysis; thermal model; thyristor; Low voltage; Power electronics; Predictive models; Resistance heating; SPICE; Surge protection; Surges; Temperature; Thyristors; Voltage control;
Conference_Titel :
Industrial Electronics, 1992., Proceedings of the IEEE International Symposium on
Conference_Location :
Xian
Print_ISBN :
0-7803-0042-4
DOI :
10.1109/ISIE.1992.279700
