• DocumentCode
    1691187
  • Title

    A novel substrate-assisted RESURF technology for small curvature radius junction

  • Author

    Qiao, Ming ; Hu, Xi ; Wen, Hengjuan ; Wang, Meng ; Luo, Bo ; Luo, Xiaorong ; Wang, Zhuo ; Zhang, Bo ; Li, Zhaoji

  • Author_Institution
    State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2011
  • Firstpage
    16
  • Lastpage
    19
  • Abstract
    A novel substrate-assisted (SA) RESURF technology aiming at improving off-state breakdown voltage (BV) of PN junction with small curvature radius is proposed and experimentally demonstrated in this paper. The SA RESURF technology not only realizes small curvature radius in the fingertip region, but also reduces electric field concentration in the curved metallurgical junction. Low-doped P-substrate, which increases depletion of the small curvature radius junction and reduces electric field concentration in the curved metallurgical junction, is adopted in the source fingertip region. Owing to the existence of low-doped P-substrate, the abrupt PN junction with small curvature radius is adjusted to low-doped PN junction with large curvature radius. The SA RESURF technology can be widely applied to lateral high voltage devices with small curved junction, especially to lateral super junction devices. A CBSLOP-LDMOS with the proposed SA RESURF technology has been developed. The experimental results show that the CBSLOP-LDMOS exhibits off-state BV of 700 V and specific on-resistance (Ron, sp) of 142 mΩ·cm2.
  • Keywords
    metallurgy; power semiconductor devices; substrates; curved metallurgical junction; electric field concentration; off-state breakdown voltage; reduced surface field technology; small curvature radius junction; substrate-assisted RESURF technology; voltage 700 V; Breakdown voltage; Electric breakdown; Electric fields; Junctions; Substrates; Surface resistance; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2011 IEEE 23rd International Symposium on
  • Conference_Location
    San Diego, CA
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4244-8425-6
  • Type

    conf

  • DOI
    10.1109/ISPSD.2011.5890779
  • Filename
    5890779