Title :
Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium (Cat. No.91CH3043-7)
Abstract :
The following topics are dealt with: TAB (tape automated bonding) manufacturing issues; manufacturing technology management; design and manufacturing of very fine pitch QFP (quad flat pack) packages; process modeling; board level manufacturing issues of very fine pitch QFP packages; automated inspection and testing; manufacturing issues in multi-chip modules (MCMs); CFC (chlorofluorocarbon) elimination and other environmental issues; product/manufacturing design tradeoffs in MCMs; and quality statistical methods and cost analysis. Abstracts of individual papers can be found under the relevant classification codes in this or other issues
Keywords :
hybrid integrated circuits; integrated circuit manufacture; lead bonding; packaging; printed circuit manufacture; ATE; CFC elimination; MCMs; TAB; automated inspection; automated testing; board level manufacturing issues; chlorofluorocarbon elimination; cost analysis; design tradeoffs; environmental issues; fine pitch QFP; manufacturing issues; manufacturing technology management; multi-chip modules; process modeling; quad flat pack; quality statistical methods; tape automated bonding;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279733
