Title :
Demountable TAB: improving manufacturability of TAB
Author :
Afshari, B. ; Heflinger, B. ; Matta, F. ; Pendse, R.D.
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
Abstract :
Area array demountable tape automated bonding (DTAB), a novel demountable, high-performance TAB package, is discussed. Special features of this package, its advantages compared to pin grid arrays (PGA), and its performance characteristics are presented. The basic concept for the package is introduced, and the advantages of this package in the manufacturing of printed circuit assemblies are discussed. Also the design of the package from the design for manufacturability point of view is explained
Keywords :
packaging; printed circuit manufacture; tape automated bonding; PC manufacture; TAB package; concept; demountable TAB; design for manufacturability; features; package; performance characteristics; tape automated bonding; Assembly; Bonding; Clocks; Electronics packaging; Integrated circuit packaging; Lead; Manufacturing; Printed circuits; Springs; Very large scale integration;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279734
