Title :
HITEN 99. Third European Conference on High Temperature Electronics. (IEEE Cat. No.99EX372)
Abstract :
Presents the front cover of the proceedings.
Keywords :
cooling; electrical contacts; high-temperature electronics; integrated circuit packaging; integrated circuit technology; semiconductor device models; semiconductor device packaging; semiconductor technology; semiconductors; silicon-on-insulator; contacts; electronics cooling; high temperature electronics; industrial applications; modelling; packaging; wide bandgap materials;
Conference_Titel :
High Temperature Electronics, 1999. HITEN 99. The Third European Conference on
Conference_Location :
Berlin, Germany
Print_ISBN :
0-7803-5795-7
DOI :
10.1109/HITEN.1999.827340
