• DocumentCode
    1691747
  • Title

    What does the customer expect from a perfectly designed and manufactured PQFP package?

  • Author

    Shinohara, Alex Akira

  • Author_Institution
    Matsushita Electron. Corp. of America, Puyallup, WA, USA
  • fYear
    1991
  • Firstpage
    64
  • Lastpage
    68
  • Abstract
    It is pointed out that customers of semiconductor packaged devices have strongly requested new, advanced SMDs which meet their requirements. Semiconductor manufacturers have made great efforts to develop and manufacture new semiconductor packages. They have endeavored to satisfy even unreasonable demands. The main reasons for the ability of Japanese semiconductor manufacturers to continue as they do now are described. In addition, mismatches of PQFP (plastic quad flat pack) package design between the Electronics Industry Association in Japan and the Joint Electronics Devices Engineering Council are considered. It is noted that the current situation cannot be considered desirable from a standardization point of view
  • Keywords
    packaging; standardisation; surface mount technology; EIAJ; Electronics Industry Association in Japan; JEDEC; Japanese semiconductor manufacturers; Joint Electronics Devices Engineering Council; PQFP; SMDs; customer expectation; fine-pitch packages; package design mismatches; plastic QFP; plastic quad flat pack; semiconductor packages; standardization; surface mount devices; Costs; Electronics packaging; Investments; Manufacturing; Meetings; Packaging machines; Pins; Semiconductor device manufacture; Semiconductor device packaging; Standardization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-0155-2
  • Type

    conf

  • DOI
    10.1109/IEMT.1991.279748
  • Filename
    279748