The latest molding technology for fine pitch P-QFP

The author describes the molding technology for fine pitch P-QFP. Problems associated with the packaging technology for fine pitch P-QFP are discussed with reference to the best directions for package structure concerning larger package, larger IC chips, thinner package, and fine lead pitch package; molding methods; and the questions of what kind of a molding compound can satisfy the above mentioned molding demands and what are the material´s physical and chemical properties and characteristics? The package structure, a new molding method, and a new molding compound are described