DocumentCode
1691944
Title
Reduction of the temperature dependence of leakage current of IGBTs by field-stop design
Author
Schulze, H.-J. ; Voss, S. ; Huesken, H. ; Niedernostheide, F.-J.
Author_Institution
Infineon Technol. AG, München, Germany
fYear
2011
Firstpage
120
Lastpage
123
Abstract
In this paper we propose a new method to reduce the temperature dependence of the leakage current of IGBTs by reducing the temperature dependence of the anode-side current gain αpnp. The temperature dependence of αpnp can be reduced by using field-stop zones that contain doping atoms with deep levels in the band gap of silicon. We demonstrate how the temperature dependence of the leakage current is influenced when using deep-level donors instead of shallow-level donors in the field-stop zone.
Keywords
deep levels; doping; elemental semiconductors; insulated gate bipolar transistors; leakage currents; silicon; IGBT leakage current; anode-side current gain α<;sub>;pnp<;/sub>;; deep levels; deep-level donors; doping atoms; field-stop design; field-stop zones; shallow-level donors; silicon band gap; Doping; Energy states; Insulated gate bipolar transistors; Leakage current; Niobium; Temperature dependence; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs (ISPSD), 2011 IEEE 23rd International Symposium on
Conference_Location
San Diego, CA
ISSN
1943-653X
Print_ISBN
978-1-4244-8425-6
Type
conf
DOI
10.1109/ISPSD.2011.5890805
Filename
5890805
Link To Document