• DocumentCode
    1691944
  • Title

    Reduction of the temperature dependence of leakage current of IGBTs by field-stop design

  • Author

    Schulze, H.-J. ; Voss, S. ; Huesken, H. ; Niedernostheide, F.-J.

  • Author_Institution
    Infineon Technol. AG, München, Germany
  • fYear
    2011
  • Firstpage
    120
  • Lastpage
    123
  • Abstract
    In this paper we propose a new method to reduce the temperature dependence of the leakage current of IGBTs by reducing the temperature dependence of the anode-side current gain αpnp. The temperature dependence of αpnp can be reduced by using field-stop zones that contain doping atoms with deep levels in the band gap of silicon. We demonstrate how the temperature dependence of the leakage current is influenced when using deep-level donors instead of shallow-level donors in the field-stop zone.
  • Keywords
    deep levels; doping; elemental semiconductors; insulated gate bipolar transistors; leakage currents; silicon; IGBT leakage current; anode-side current gain α<;sub>;pnp<;/sub>;; deep levels; deep-level donors; doping atoms; field-stop design; field-stop zones; shallow-level donors; silicon band gap; Doping; Energy states; Insulated gate bipolar transistors; Leakage current; Niobium; Temperature dependence; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2011 IEEE 23rd International Symposium on
  • Conference_Location
    San Diego, CA
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4244-8425-6
  • Type

    conf

  • DOI
    10.1109/ISPSD.2011.5890805
  • Filename
    5890805