Title :
A process model of the infra-red reflow soldering of printed circuit board assemblies
Author :
Whalley, David C. ; Ogunjimi, Adebayo O. ; Conway, Paul P. ; Williams, David J.
Author_Institution :
Dept. of Manuf. Eng., Loughborough Univ. of Technol., UK
Abstract :
The authors present the latest results of an evolving model of the infra-red reflow soldering process. Recent additions to earlier models are the convective cooling of the PCB (printed circuit board) as it exits from the furnace muffle, and the addition of realistic component structures to the PCB assembly. The authors also present the initial results from a second model of a high production volume, high quality, mass manufacture oven. The output from all of these models is a time-temperature distribution for the assembly in question, allowing the identification of heating and cooling rates in the assembly, the peak temperatures of the individual components, and the time above reflow temperature for the solder joints
Keywords :
assembling; printed circuit manufacture; process control; soldering; temperature distribution; convective cooling; cooling rates; heating rates; high production volume; infra-red reflow soldering; mass manufacture oven; peak temperatures; printed circuit board assemblies; process model; realistic component structures; solder joints; time above reflow temperature; time-temperature distribution; Assembly; Cooling; Furnaces; Mass production; Ovens; Printed circuits; Reflow soldering; Semiconductor device modeling; Temperature distribution; Virtual manufacturing;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279761
