Title :
Development of fine pitch and high lead count ceramic QFP
Author :
Nakatsuka, Yasuo ; Tamura, Y. ; Okabayashi, T. ; Fujii, H. ; Yokochi, M.
Author_Institution :
Sumitomo Metal Ind. Ltd., Hyogo, Japan
Abstract :
A compact ceramic quad flat package (C-QFP) for use in logic LSI devices with fine pitch and high lead counts has been developed. The ceramic base outer size of the new C-QFP with 356 inner leads and 288 outer leads is 27 mm by 30 mm. The pitch of the inner and outer lead is 0.15 and 0.38 mm, respectively. The new C-QFP is composed of a fine pitch thin film wiring layer on a ceramic base interconnected to the outer leads by a single point bonding system. A novel process was developed for assembly of the new C-QFP
Keywords :
ceramics; integrated circuit technology; large scale integration; microassembling; packaging; assembly; ceramic QFP; fine pitch; high lead count; logic LSI devices; single point bonding system; thin film wiring layer; Assembly; Bonding; Ceramics; Electronics packaging; Large scale integration; Lead; Logic devices; Manganese alloys; Metals industry; Wiring;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279772
