Title :
Packaging alternatives for high lead count, fine pitch, surface mount technology
Author :
Chroneos, R. ; Mallik, D. ; Prough, S.
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
It is noted that fine pitch SMT (surface mount technology) components potentially offer substantial benefits for cost, performance, and miniaturization in assembly of high integration, high lead count ICs in portable electronic systems. However, several issues involving component handling, solder process, rework, and reliability concerns must first be overcome. It is noted that a variety of packaging alternatives exist today for surface mount high leadcount components. Any choice must address these surface mount issues as well as the requirements of next-generation highly integrated, high-performance IC devices. Details of various packaging alternatives are discussed
Keywords :
circuit reliability; integrated circuit technology; soldering; surface mount technology; component handling; fine pitch; high lead count; high-performance IC devices; packaging alternatives; portable electronic systems; reliability; rework; solder process; surface mount technology; Assembly; Computer aided manufacturing; Costs; Electronics packaging; High performance computing; Integrated circuit packaging; Microcomputers; Microprocessors; Plastic packaging; Surface-mount technology;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279773
