Title : 
Performance and reliability of a 10-Gbit/s optical receiver module using a novel plastic package
         
        
            Author : 
Kurosaki, Takeshi ; Shuto, Yoshito ; Tadokoro, Takashi ; Yokoyama, Kenji ; Endo, Jun ; Amano, M. ; Nakamura, Makoto ; Ishihara, Noboru ; Suzuk, Yasuhiro
         
        
            Author_Institution : 
iNTT Photonics Labs., NTT Corp., Atsugi, Japan
         
        
        
            fDate : 
6/24/1905 12:00:00 AM
         
        
        
        
            Abstract : 
A low-cost 10-Gbit/s optical receiver module constructed using a novel plastic package and a simplified assembling technique was investigated. Passive alignment using a glass V-groove substrate and an edge-illuminated refracting-facet photodiode (RFPD) were employed to reduce cost and achieve high-speed operation. A Si-bipolar preamplifier IC was mounted on the package to reduce power consumption. High-speed signal lines with wide frequency bandwidth of more than 10 GHz on the package were realized using a three-dimensional electromagnetic field analysis. For receiver operations, a 3-dB detection bandwidth of 7.7 GHz and sensitivity of less than -14 dBm at 10 Gbit/s were achieved. To clarify the reliability of the fabricated module, high-humidity (damp-heat) and temperature-cycling tests were performed. For these tests, a RFPD, a preamplifier IC, and a fiber on a glass V-groove substrate were covered with a silicone resin. During both tests, stable operations of the modules, variation of responsivity of less than 1 dB and dark current of less than 200 nA, were confirmed.
         
        
            Keywords : 
integrated circuit reliability; life testing; modules; optical fibre communication; optical receivers; photodiodes; plastic packaging; preamplifiers; 10 Gbit/s; 3-dB detection bandwidth; 7.7 GHz; Si; assembling technique; dark current; edge-illuminated refracting-facet photodiode; glass V-groove substrate; high-humidity tests; high-speed operation; high-speed signal lines; optical receiver module; passive alignment; plastic package; power consumption; preamplifier IC; reliability; responsivity; sensitivity; silicone resin; temperature-cycling tests; three-dimensional electromagnetic field analysis; Assembly; Bandwidth; Electromagnetic refraction; Glass; Optical receivers; Optical refraction; Photodiodes; Plastic packaging; Preamplifiers; Testing;
         
        
        
        
            Conference_Titel : 
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
         
        
        
            Print_ISBN : 
0-7803-7430-4
         
        
        
            DOI : 
10.1109/ECTC.2002.1008066