DocumentCode :
1692398
Title :
TARGET: thermal accelerated reliability go-no-go environmental testing dynamic board thermal shock using a single liquid fluorocarbon bath
Author :
Beaton, Bradford P.
Author_Institution :
NCR Corp., West Columbia, SC, USA
fYear :
1991
Firstpage :
212
Lastpage :
214
Abstract :
TARGET, a novel method of accelerated thermal stress for board testing, is described. This method utilizes Fluorinert as the medium for rapid thermal energy transfer. Possible applications include environments for STRIFE testing and board debug. One of the most promising applications is in-line environmental stress screening (ESS). Boards receive a thorough temperature stress screen in the time taken for conventional go-no-go tests. The process is described in detail and analyzed. Data from initial experiments are presented
Keywords :
circuit reliability; environmental testing; life testing; printed circuit testing; thermal shock; Fluorinert; STRIFE testing; TARGET; accelerated thermal stress; board debug; dynamic board thermal shock; in-line environmental stress screening; reliability go-no-go environmental testing; single liquid fluorocarbon bath; Costs; Electric shock; Energy exchange; Fixtures; Life estimation; Refrigerants; Technological innovation; Temperature; Testing; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
Type :
conf
DOI :
10.1109/IEMT.1991.279779
Filename :
279779
Link To Document :
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