Title :
Dynamic modeling of five-bar manipulator with structurally flexible linkages
Author :
Wang, Hong ; Xing, Yanwen ; Li, Yanjie ; Li, Zexiang
Author_Institution :
Dept. of Control & Mechatron. Eng., Harbin Inst. of Technol., Shenzhen, China
Abstract :
In this paper, we investigate a planar parallel mechanism called five-bar mechanism which is used in wire bonders of semiconductor packaging system where the required accuracy is about 2 (um), acceleration reaches 10-15 (g). However, the conventional modeling and analyzing methods that treat all components of the manipulator as rigid and ignore all possible deformations, definitely are insufficient to satisfy those rigorous demands. Thus, in this paper, the dynamic model with consideration of both rigid motion and flexible displacement is developed for the five-bar manipulator. Finite element and Lagrange´s equation methods are used to get the mathematical model, Lagrange multiplier method is applied to deal with constraint equations. By comparing dynamic behavior of the system modeled by rigid bodies and flexible bodies, the proposed flexible model is well validated, meanwhile, some analysis from simulation results are given.
Keywords :
finite element analysis; lead bonding; manipulator dynamics; semiconductor device packaging; FEM; Lagrange equation methods; Lagrange multiplier method; finite element methods; five-bar manipulator dynamic modeling; flexible bodies; flexible displacement; planar parallel mechanism; rigid bodies; rigid motion; semiconductor packaging system; structurally flexible linkages; wire bonders; Couplings; Equations; Finite element methods; Joints; Manipulator dynamics; Mathematical model; Dynamic modeling; Five-bar mechanism; Structurally flexible linkages;
Conference_Titel :
Intelligent Control and Automation (WCICA), 2010 8th World Congress on
Conference_Location :
Jinan
Print_ISBN :
978-1-4244-6712-9
DOI :
10.1109/WCICA.2010.5554633