DocumentCode :
1692533
Title :
Application of design of experiments methodology to model the effect of multiple parameters on simultaneous switching noise
Author :
Zilaro, Patrick ; Giotta, Paul ; Hawks, Doug ; Macias, Carlos
Author_Institution :
Mindspeed Technol., Newport Beach, CA, USA
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
79
Lastpage :
85
Abstract :
A new methodology is developed for efficiently analyzing simultaneous switching noise (SSN) using design of experiments (DOE) to model the effect of multiple adjustable parameters on SSN responses, such as ground bounce and local supply droop. Each SSN response is fitted to a 2nd order polynomial equation allowing quick calculation of SSN as a function of load capacitance, number of drivers switching, power/ground inductance, power/ground resistance, on-chip de-coupling capacitance, and rise/fall time of the driver input pulse. This method is applied to two separate driver types to demonstrate the approach, and show that certain parameters are more or less significant for one driver, but not the other. Statistical analysis shows that only two of the five responses are unique to SSN. Drivers are characterized using this method, and the analytical expressions provide immediate feedback for making engineering decisions regarding future IC pad-rings and package designs. Results are presented to demonstrate the validity of the proposed methodology and its application for optimizing SSN designs.
Keywords :
capacitance; design of experiments; integrated circuit design; integrated circuit noise; integrated circuit packaging; statistical analysis; IC pad-rings; design of experiments methodology; ground bounce; load capacitance; local supply droop; multiple adjustable parameters; multiple parameters; on-chip de-coupling capacitance; package designs; package electrical characterization; polynomial equation; power/ground inductance; power/ground resistance; rise/fall time; simultaneous switching noise; statistical analysis; Capacitance; Design engineering; Design methodology; Equations; Feedback; Inductance; Integrated circuit packaging; Polynomials; Statistical analysis; US Department of Energy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN :
0569-5503
Print_ISBN :
0-7803-7430-4
Type :
conf
DOI :
10.1109/ECTC.2002.1008076
Filename :
1008076
Link To Document :
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